Remote communication and powered sensing/control/identification devices using high temperature compatible semiconductor materials

ABSTRACT

A system includes a network of a plurality of sensing/control/identification devices distributed throughout a machine, each of the sensing/control/identification devices associated with at least one sub-system component of the machine and operable to communicate through a plurality of electromagnetic signals. Shielding surrounds at least one of the sensing/control/identification devices to contain the electromagnetic signals proximate to the at least one sub-system component. A communication path is integrally formed in a component of the machine to route a portion of the electromagnetic signals through the component and a remote processing unit operable to communicate with the network of the sensing/control/identification devices through the electromagnetic signals, wherein at least a portion of the sensing/control/identification devices comprise a wide band gap semiconductor device.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation-in-part of U.S. patent applicationSer. No. 15/114,234 filed on Jul. 26, 2016, which is a U.S. NationalStage of Application No. PCT/US2015/016761 filed on Feb. 20, 2015, whichclaims the benefit of U.S. Provisional Patent Application No. 61/946,064filed on Feb. 28, 2014, the contents of each of these applications areincorporated herein by reference thereto.

BACKGROUND

This disclosure relates to electromagnetic communication, and moreparticularly to remote communication to and from and powering ofsensing/control/identification devices that use high temperaturesemiconductor materials and devices to enable these systems.

A gas turbine engine typically includes a fan section, a compressorsection, a combustor section and a turbine section. Air entering thecompressor section is compressed and delivered into the combustorsection where it is mixed with fuel and ignited to generate a high-speedexhaust gas flow. The high-speed exhaust gas flow expands through theturbine section to drive the compressor and the fan section. Thecompressor section typically includes low and high pressure compressors,and the turbine section includes low and high pressure turbines.

Detailed knowledge of gas turbine engine and other machinery operationfor control or health monitoring requires sensing systems that needinformation from locations that are sometimes difficult to access due tomoving parts, internal operating environment or machine configuration.The access limitations make wire routing bulky, expensive, andvulnerable to interconnect failures. The sensor and interconnectoperating environments for desired sensor locations often exceed thecapability of the interconnect systems. In some cases, cable cost,volume, and weight exceed the desired limits for practical applications.

Application of electromagnetic sensor technologies to address the wiringconstraints faces the challenge of providing reliable communications ina potentially unknown environment with potential interference frominternal or external sources. Particularly, where conventionalsemiconductor devices have limited functionality in high temperatureapplications.

BRIEF DESCRIPTION

In an embodiment, a system includes a network of a plurality ofsensing/control/identification devices distributed throughout a machine,each of the sensing/control/identification devices associated with atleast one sub-system component of the machine and operable tocommunicate through a plurality of electromagnetic signals. Shieldingsurrounds at least one of the sensing/control/identification devices tocontain the electromagnetic signals proximate to the at least onesub-system component. A communication path is integrally formed in acomponent of the machine to route a portion of the electromagneticsignals through the component and a remote processing unit operable tocommunicate with the network of the sensing/control/identificationdevices through the electromagnetic signals, wherein at least a portionof the sensing/control/identification devices comprise a wide band gapsemiconductor device.

In addition to one or more of the features described above, or as analternative to any of the foregoing embodiments, the wide band gapsemiconductor device includes silicon on insulator (SOI), siliconcarbide (SiC), gallium nitride (GaN), boron nitride, aluminum nitride,or a combination comprising at least one of the foregoing.

In addition to one or more of the features described above, or as analternative to any of the foregoing embodiments, the wide band gapsemiconductor device operates at a temperature greater than 200 degreesC.

In addition to one or more of the features described above, or as analternative to any of the foregoing embodiments, the wide band gapsemiconductor device includes an integrated device having bipolarjunction transistors, field effect transistors, or a combinationcomprising at least one of the foregoing.

In addition to one or more of the features described above, or as analternative to any of the foregoing embodiments, the wide band gapsemiconductor device includes a bipolar structure, MOSFET, JFET, lightemitting diode, oscillator, diode or a combination comprising at leastone of the foregoing.

In addition to one or more of the features described above, or as analternative to any of the foregoing embodiments, the wide band gapsemiconductor device is part of an integrated circuit.

In addition to one or more of the features described above, or as analternative to any of the foregoing embodiments, the wide band gapsemiconductor device includes SiC, GaN or a combination thereof.

According to an embodiment, systems for gas turbine engines areprovided. The systems include a network of a plurality ofsensing/control/identification devices distributed throughout the gasturbine engine, each of the sensing/control/identification devicesassociated with at least one sub-system component of the gas turbineengine and operable to communicate through a plurality ofelectromagnetic signals. Shielding surrounds at least one of thesensing/control/identification devices to contain the electromagneticsignals proximate to the at least one sub-system component. Acommunication path is integrally formed in a component of the gasturbine engine to route a portion of the electromagnetic signals throughthe component. The system also includes a remote processing unitoperable to communicate with the network of thesensing/control/identification devices through the electromagneticsignals. At least a portion of the sensing/control/identificationdevices comprise a wide band gap semiconductor device.

In addition to one or more of the features described above, or as analternative to any of the foregoing embodiments, the wide band gapsemiconductor device includes silicon on insulator (SOI), siliconcarbide (SiC), gallium nitride (GaN), boron nitride, aluminum nitride,or a combination comprising at least one of the foregoing.

In addition to one or more of the features described above, or as analternative to any of the foregoing embodiments, the wide band gapsemiconductor device operates at a temperature greater than 200 degreesC.

In addition to one or more of the features described above, or as analternative to any of the foregoing embodiments, the wide band gapsemiconductor device includes an integrated device having bipolarjunction transistors, field effect transistors, or a combinationcomprising at least one of the foregoing.

In addition to one or more of the features described above, or as analternative to any of the foregoing embodiments, the wide band gapsemiconductor device includes a bipolar structure, MOSFET, JFET, lightemitting diode, oscillator, diode or a combination comprising at leastone of the foregoing.

In addition to one or more of the features described above, or as analternative to any of the foregoing embodiments, the wide band gapsemiconductor device is part of an integrated circuit.

In addition to one or more of the features described above, or as analternative to any of the foregoing embodiments, the wide band gapsemiconductor device includes SiC, GaN or a combination thereof.

According to an embodiment, a method of electromagnetic communicationthrough a machine includes transmitting communication signals between aremote processing unit and a network of a plurality ofcontrol/sensing/identification devices in the machine using a pluralityof electromagnetic signals. The plurality of electromagnetic signalsprovide power to the control/sensing devices. At least a portion of thecontrol/sensing/identification devices comprise a wide band gapsemiconductor device.

In addition to one or more of the features described above, or as analternative to any of the foregoing embodiments, the wide band gapsemiconductor device includes silicon on insulator (SOI), siliconcarbide (SiC), gallium nitride (GaN), boron nitride, aluminum nitride,or a combination comprising at least one of the foregoing.

In addition to one or more of the features described above, or as analternative to any of the foregoing embodiments, the wide band gapsemiconductor device operates at a temperature greater than 200 degreesC.

In addition to one or more of the features described above, or as analternative to any of the foregoing embodiments, the wide band gapsemiconductor device comprises an integrated device having bipolarjunction transistors, field effect transistors, or a combinationcomprising at least one of the foregoing.

In addition to one or more of the features described above, or as analternative to any of the foregoing embodiments, the wide band gapsemiconductor device is part of an integrated circuit.

In addition to one or more of the features described above, or as analternative to any of the foregoing embodiments, the wide band gapsemiconductor device comprises SiC, GaN or a combination thereof.

BRIEF DESCRIPTION OF THE DRAWINGS

The subject matter which is regarded as the present disclosure isparticularly pointed out and distinctly claimed in the claims at theconclusion of the specification. The foregoing and other features, andadvantages of the present disclosure are apparent from the followingdetailed description taken in conjunction with the accompanying drawingsin which:

FIG. 1 is a cross-sectional view of a gas turbine engine;

FIG. 2 is a schematic view of an example control and health monitoringsystem including a shielded electromagnetic network in accordance withan embodiment of the disclosure;

FIG. 3 is a schematic view of a communication path through a componentin accordance with an embodiment of the disclosure;

FIG. 4 is a schematic view of a waveguide in accordance with anembodiment of the disclosure;

FIG. 5 is a schematic view of another waveguide in accordance with anembodiment of the disclosure; and

FIG. 6 is a schematic diagram of a sensing/control/identification deviceconfiguration in accordance with a non-limiting embodiment of thepresent disclosure;

FIG. 7 is a schematic diagram of another sensing/control/identificationdevice configuration in accordance with a non-limiting embodiment of thepresent disclosure;

FIG. 8 is a schematic diagram of another sensing/control/identificationdevice configuration in accordance with a non-limiting embodiment of thepresent disclosure; and

FIG. 9 is a schematic illustration of an on-chip antenna employed withembodiments of the present disclosure.

FIG. 10 is a graph depicting temperature capability of varioussemiconductor materials and their thermal limitations.

DETAILED DESCRIPTION

Various embodiments of the present disclosure are related toelectromagnetic communication in a machine. FIG. 1 schematicallyillustrates a gas turbine engine 20 as one example of a machine asfurther described herein. The gas turbine engine 20 is depicted as atwo-spool turbofan that generally incorporates a fan section 22, acompressor section 24, a combustor section 26 and a turbine section 28.Alternative engines may include an augmentor section (not shown) amongother systems or features. The fan section 22 drives air along a bypassflow path B in a bypass duct to provide a majority of the thrust, whilethe compressor section 24 drives air along a core flow path C forcompression and communication into the combustor section 26 thenexpansion through the turbine section 28. Although depicted as atwo-spool turbofan gas turbine engine in the disclosed non-limitingembodiment, it should be understood that the concepts described hereinare not limited to use with two-spool turbofans as the teachings may beapplied to other types of turbine engines including three-spoolarchitectures or any other machine that requires sensors to operate withsimilar environmental challenges or constraints. Additionally, theconcepts described herein may be applied to any machine or systemcomprised of control and/or health monitoring systems.

The exemplary engine 20 generally includes a low speed spool 30 and ahigh speed spool 32 mounted for rotation about an engine centrallongitudinal axis A relative to an engine static structure 36 viaseveral bearing systems 38. It should be understood that various bearingsystems 38 at various locations may alternatively or additionally beprovided, and the location of bearing systems 38 may be varied asappropriate to the application.

The low speed spool 30 generally includes an inner shaft 40 thatinterconnects a fan 42, a first (or low) pressure compressor 44 and afirst (or low) pressure turbine 46. The inner shaft 40 is connected tothe fan 42 through a speed change mechanism, which in exemplary gasturbine engine 20 is illustrated as a geared architecture 48 to drivethe fan 42 at a lower speed than the low speed spool 30. The high speedspool 32 includes an outer shaft 50 that interconnects a second (orhigh) pressure compressor 52 and a second (or high) pressure turbine 54.A combustor 56 is arranged in exemplary gas turbine engine 20 betweenthe high pressure compressor 52 and the high pressure turbine 54. Amid-turbine frame 58 of the engine static structure 36 is arrangedgenerally between the high pressure turbine 54 and the low pressureturbine 46. The mid-turbine frame 58 further supports bearing systems 38in the turbine section 28. The inner shaft 40 and the outer shaft 50 areconcentric and rotate via bearing systems 38 about the engine centrallongitudinal axis A which is collinear with their longitudinal axes.

The core airflow is compressed by the low pressure compressor 44 thenthe high pressure compressor 52, mixed and burned with fuel in thecombustor 56, then expanded over the high pressure turbine 54 and lowpressure turbine 46. The mid-turbine frame 58 includes airfoils 60 whichare in the core airflow path C. The turbines 46, 54 rotationally drivethe respective low speed spool 30 and high speed spool 32 in response tothe expansion. It will be appreciated that each of the positions of thefan section 22, compressor section 24, combustor section 26, turbinesection 28, and fan drive gear system 48 may be varied. For example,gear system 48 may be located aft of combustor section 26 or even aft ofturbine section 28, and fan section 22 may be positioned forward or aftof the location of gear system 48.

The engine 20 in one example is a high-bypass geared aircraft engine. Ina further example, the engine 20 bypass ratio is greater than about six(6), with an example embodiment being greater than about ten (10), thegeared architecture 48 is an epicyclic gear train, such as a planetarygear system or other gear system, with a gear reduction ratio of greaterthan about 2.3 and the low pressure turbine 46 has a pressure ratio thatis greater than about five. In one disclosed embodiment, the engine 20bypass ratio is greater than about ten (10:1), the fan diameter issignificantly larger than that of the low pressure compressor 44, andthe low pressure turbine 46 has a pressure ratio that is greater thanabout five 5:1. Low pressure turbine 46 pressure ratio is pressuremeasured prior to inlet of low pressure turbine 46 as related to thepressure at the outlet of the low pressure turbine 46 prior to anexhaust nozzle. The geared architecture 48 may be an epicycle geartrain, such as a planetary gear system or other gear system, with a gearreduction ratio of greater than about 2.3:1. It should be understood,however, that the above parameters are only exemplary of one embodimentof a geared architecture engine and that the present invention isapplicable to other gas turbine engines including direct driveturbofans.

A significant amount of thrust is provided by the bypass flow B due tothe high bypass ratio. The fan section 22 of the engine 20 is designedfor a particular flight condition—typically cruise at about 0.8 Mach andabout 35,000 feet (10.67 km). The flight condition of 0.8 Mach and35,000 ft (10.67 km), with the engine at its best fuel consumption—alsoknown as “bucket cruise Thrust Specific Fuel Consumption (‘TSFC’)”—isthe industry standard parameter of lbm of fuel being burned divided bylbf of thrust the engine produces at that minimum point. “Low fanpressure ratio” is the pressure ratio across the fan blade alone,without a Fan Exit Guide Vane (“FEGV”) system. The low fan pressureratio as disclosed herein according to one non-limiting embodiment isless than about 1.45. “Low corrected fan tip speed” is the actual fantip speed in ft/sec divided by an industry standard temperaturecorrection of [(Tram ° R)/(518.7° R)]0.5. The “Low corrected fan tipspeed” as disclosed herein according to one non-limiting embodiment isless than about 1150 ft/second (350 m/second).

The example gas turbine engine includes the fan 42 that comprises in onenon-limiting embodiment less than about twenty-six (26) fan blades. Inanother non-limiting embodiment, the fan section 22 includes less thanabout twenty (20) fan blades. Moreover, in one disclosed embodiment thelow pressure turbine 46 includes no more than about six (6) turbinerotors schematically indicated at 34. In another non-limiting exampleembodiment the low pressure turbine 46 includes about three (3) turbinerotors. A ratio between the number of fan blades 42 and the number oflow pressure turbine rotors is between about 3.3 and about 8.6. Theexample low pressure turbine 46 provides the driving power to rotate thefan section 22 and therefore the relationship between the number ofturbine rotors 34 in the low pressure turbine 46 and the number ofblades 42 in the fan section 22 disclose an example gas turbine engine20 with increased power transfer efficiency.

The disclosed example gas turbine engine 20 includes a control andhealth monitoring system 64 (generally referred to as system 64)utilized to monitor component performance and function. In this example,a sensing/control/identification device (SCID) 68A is located within asub-system component (SSC) 70. The SCID 68A communicates withelectromagnetic energy to a remote processing unit (RPU) 66 through apath comprised of a transmission path 78 and a path 62 within a SSC 70as best seen in FIG. 2. The path may also be extended along one or moreshielded paths 72 to remote SCIDs 68B in separate SSCs 74 (FIG. 2). Thisentire path (e.g., transmission path 78, path 62, and shielded paths 72)comprises a shielded electromagnetic network (SEN) 65. The RPU 66 maytransmit signals to a network 71 of the SCID 68A, 68B (FIG. 2) and/orreceive information indicative of current operation of the componentbeing monitored. The transmission media for any portion of the SEN 65may include solid, liquid, or gaseous material. In this example, apressure internal to the SSC 70 is monitored and that informationtransmitted through the path 62 of the SEN 65 to the RPU 66 for use incontrolling engine operation or monitoring component health. However, itshould be understood that it is within the contemplation of thisdisclosure that the disclosed system 64 may be utilized to controland/or monitor any component function or characteristic of aturbomachine or aircraft component operation and/or other machines.

Prior control & diagnostic system architectures utilized in variousapplications include centralized system architecture in which theprocessing functions reside in an electronic control module. Redundancyto accommodate failures and continue system operation systems areprovided with dual channels with functionality replicated in bothcontrol channels. Actuator and sensor communication is accomplishedthrough analog wiring for power, command, position feedback, sensorexcitation and sensor signals. Cables and connections include shieldingto minimize effects caused by electromagnetic interference (EMI). Theuse of analog wiring and the required connections limits application andcapability of such systems due to the ability to locate wires,connectors, and electronics in small and harsh environments thatexperience extremes in temperature, pressure, and/or vibration.

Referring to FIG. 2, system 64 includes SEN 65 installed near, in, or oneach of several SSCs 70A-C, as examples of the SSC 70 of FIG. 1. Each ofthe SSCs 70A-C may be an engine component, actuator, or any othermachine part from which information and communication is performed formonitoring and/or control purposes. In this example, each of the SSCs70A-C includes a path 62 of the SEN 65 that is the primary means ofcommunicating with one or multiple features of the particular SSC 70A-Cor remotely located SSCs 74. The remotely located SSCs 74 may contain asingle or multiple electronic circuits or sensors configured tocommunicate over the SEN 65.

The RPU 66 sends and receives power and data to and from the SSCs 70A-Cand may also provide a communication link between different SSCs 70A-C.The RPU 66 may be located on equipment near other system components orlocated remotely as desired to meet application requirements.

A transmission path (TP) 78 between the RPU 66 and SSCs 70A-C is used tosend and receive data routed through the RPU 66 from a control module orother components. The TP 78 may utilize electrical wire, optic fiber,waveguide, or any other electromagnetic communication including radiofrequency/microwave electromagnetic energy, visible, or non-visiblelight. The interface between the TP 78 and SSC 70A-C transmits power andsignals received through the TP 78 to one or multiple SCIDs 68A in theexample SSC 70A.

The example SCIDs 68A, 68B may be radio-frequency identification (RFID)devices that include processing, memory, and/or the ability to connectto conventional sensors or effectors such as solenoids orelectro-hydraulic servo valves. The SSC 70A may contain radio frequency(R/F) antennas, magnetic devices, or optic paths designed to be poweredand/or communicate to and/or from the TP 78 paths. The SSCs 70A-C mayalso use shielded paths 72 that can be configured as any type ofelectromagnetic communication, including, for instance, radio frequency,microwaves, magnetic, or optic waveguide transmission to the SCIDs 68Blocated within the remotely located SSCs 74.

Shielding 84 within and around the SSC 70A is provided such thatelectromagnetic energy or light interference 85 with electromagneticsignals 86 (shown schematically as arrows) within the SSC 70A aremitigated. Moreover, the shielding 84 provides that the signals 86 areless likely to propagate into the environment outside the SSC 70A andenable unauthorized access to information. Similarly, remotely locatedSSCs 74 can each include respective shielding 76 to limit signalpropagation to shielded paths 72. In some embodiments, confinedelectromagnetic radiation is in the range 1-100 GHz. Electromagneticradiation can be more tightly confined around specific carrierfrequencies, such as 3-4.5 GHz, 24 GHz, 60 GHz, or 76-77 GHz as examplesin the microwave spectrum. A carrier frequency can transmit electricpower, as well as communicate information, to multiple SCIDs 68A, 68Busing various modulation and signaling techniques.

RFID, electromagnetic, or optical devices implemented as the SCIDs 68A,68B can provide information indicative of a physical parameter, such aspressure, temperature, speed, proximity, vibration, identification,and/or other parameters used for identifying, monitoring, and/orcontrolling component operation. The SCIDs 68A, 68B may also includecontrol devices such as a solenoid, switch, or other physical actuationdevices. Signals communicated over the TP 78 may employ techniques suchas checksums, hash algorithms, shielding, and/or encryption to mitigatecyber security threats and interference.

The disclosed system 64 containing the SEN 65 (e.g., transmission path78, path 62, and shielded paths 72) provides a communication linkbetween the RPU 66 and multiple SSCs 70A-C, 74. The shielding 84, 76 canbe provided along the transmission path 78 and for each SSC 70A-C and 74such that power and communication signals are shielded from outsideinterference, which may be caused by environmental electromagnetic oroptic interference. Moreover, the shielding 84, 76 prevents intentionalinterference 85 with communication at each component. Intentionalinterference 85 may take the form of unauthorized data capture, datainsertion, general disruption, and/or any other action that degradessystem communication. Environmental sources of interference 85 mayoriginate from noise generated from proximate electrical systems inother components or machinery along with electrostatic fields, and/orany broadcast signals from transmitters or receivers. Additionally, pureenvironmental phenomena, such as cosmic radio frequency radiation,lightning, or other atmospheric effects could interfere with localelectromagnetic communications. Accordingly, the individualizedshielding 84, 76 for each of the SSCs 70A-C and 74 prevent the undesiredinterference with communication. The shielding 84, 76 may be applied toenclosed or semi-enclosed volumes that contain the SCIDs 68.

It should be appreciated that while the system 64 is explained by way ofexample with regard to a gas turbine engine 20, other machines andmachine designs can be modified to incorporate built-in shielding foreach monitored or controlled components to enable the use of a SEN. Forexample, the system 64 can be incorporated in a variety of harshenvironment machines, such as an elevator system, heating, ventilation,and air conditioning (HVAC) systems, manufacturing and processingequipment, a vehicle system, an environmental control system, and allthe like. The disclosed system 64 includes the SEN 65 that enablesconsistent communication with electromagnetic devices, such as theexample SCIDs 68A, 68B, and removes variables encountered withelectromagnetic communications such as distance between transmitters andreceiving devices, physical geometry in the field of transmission,control over transmission media such as air or fluids, control over airor fluid contamination through the use of filtering, or isolation andknowledge of temperature and pressure.

The system 64 provides for localized transmission to SCIDs 68A, 68B suchthat power requirements are reduced. Localized transmission occurswithin a shielded volume of each SSC 70A-C, 74 that is designedspecifically to accommodate reliable electromagnetic transmission forthe application specific environment and configuration. Shielding oflocalized components is provided such that electromagnetic signals arecontained within the shielding 84 for a specific instance of the SSC70A-C. The system 64 therefore enables communication with one ormultiple SCIDs 68 simultaneously. The example RPU 66 enables sending andreceiving of power and data between several different SSCs 70A-C and 74.The RPU 66 may be located on the equipment near other system componentsor located away from the machinery for any number of reasons.

The system 64 provides for a reduction in cable and interconnectingsystems to reduce cost and increases reliability by reducing the numberof physical interconnections. Reductions in cable and connecting systemsfurther provides for a reduction in weight while enabling additionalredundancy without significantly increasing cost. Moreover, additionalsensors can be added without the need for additional wiring andconnections that provide for increased system accuracy and response.Finally, the embodiments enable a “plug-n-play” approach to add a newSCID, potentially without a requalification of the entire system butonly the new component; thereby greatly reducing qualification costs andtime.

The TP 78 between the RPU 66 and the SSCs 70A-C utilized to send andreceive data from other components may take multiple forms such aselectrical wire, optic fiber, radio frequency signals or energy withinthe visible or non-visible light spectrum. The numerous options for acommunication path of the TP 78 enable additional design flexibility.The TP 78 transfers energy to the SSC 70A-C such that one or multipleSCIDs 68A, 68B can be multiplexed over one TP 78 to the RPU 66.

SCIDs 68A, 68B can include RFID devices that may or may not includeprocessing, memory, and/or the ability to connect to conventionalsensors. Radio frequency (R/F) antennas, magnetic devices, or opticpaths within the SSCs 70A-C may be designed to communicate with one ormultiple SCIDs 68A, 68B. Moreover, R/F, microwave, magnetic, or opticwaveguide transmission paths 72 can be utilized to communicate withindividual electromagnetic devices remotely located from the SSC 70A-C.

Shielding 84, 76 within and around the SSC 70A-C, 74 substantiallyprevents electromagnetic energy or light interference with signals andalso makes it less likely that signals can propagate into thesurrounding environment to prevent unauthorized access to information.

According to embodiments, electromagnetic (EM) communication with thesystem 64 can be performed through multi-material andfunctional/structural components including, for instance, fuel, oil,engineered dielectrics, and enclosed free spaces. By forming waveguidesthrough existing machine components and using electromagneticcommunication for one or more of the TP 78, path 62, and/or shieldedpaths 72, system contaminants and waveguide size for given frequenciescan be reduced.

In embodiments, existing components of the gas turbine engine 20 of FIG.1 can be used to act as waveguides filled with air, fluids, or aspecifically implemented dielectric to transmit EM energy for writingand reading to/from EM devices in a Faraday cage protected environment.Use of existing structure can allow waveguide channels to be built in atthe time of manufacture by machining passages or additivelymanufacturing waveguide channels as communication paths. For example,communication paths can be built into the structure of SSCs 70A-C and 74to guide EM energy through each component. The SSCs 70A-C and 74 maycontain gas such as air at atmospheric pressure or any other level, orliquids such as oil or fuel. In any part of the system 64, a dielectricmay be employed to resist contamination or to reduce requirements forwaveguide dimensions.

Various machine components may also be used for transmission if theproper waveguide geometry is designed into the component, which can alsoprovide functional and structural aspects of the machine. Examples, suchas machine housings, fluid (including air) fill tubes, hydraulic lines,support frames and members, internal machine parts and moving parts thatcan be coupled to or shaped into waveguide geometry may also beincorporated in embodiments. As one example, FIGS. 2 and 3 depict aplurality of compressor vane segments 104 of the compressor section 24of FIG. 1 that incorporate one or more communication paths 102integrally formed in/on a component of the gas turbine engine 20 ofFIG. 1. Each communication path 102 can route a portion ofelectromagnetic signals communicated from the TP 78 to one or more ofthe SCIDs 68 of FIG. 3. Each communication path 102 also provides apotentially alternate route in which the electromagnetic signal can bechanneled in the event of a line or linkage failure, thereby building ininherent redundancy and system level robustness.

In the example of FIG. 3, a compressor vane segment 104 includes anarcuate outer vane platform segment 106 and an arcuate inner vaneplatform segment 108 radially spaced apart from each other. The arcuateouter vane platform segment 106 may form an outer portion and thearcuate inner vane platform segment 108 may form an inner portion to atleast partially define an annular compressor vane flow path.

Communication path 102 in a vane 112 can be formed during amanufacturing process to directly carry electromagnetic signaling of theTP 78 through a component of the gas turbine engine 20 of FIG. 1directly to a SCID 68 depicted in FIG. 3. Communication path 102 canalso terminate with SCIDs 68 to read pressures, temperatures, or otherparameters at the end of the TP 78 or 72. Waveguide usage can enablevery low transmission losses such that the RPU 66 of FIG. 2 can bephysically located much farther away from the SCIDs 68A, 68B of FIG. 2than conventional free space transmitting devices. Use of a dielectricin the waveguides can reduce the dimensional requirements for thewaveguides and resist contaminants, such as moisture, particles, gases,corrosion, and/or liquids that may increase transmission losses.Embodiments can use fluids in existing systems to act as a dielectric,particularly fluids with a dielectric constant that approaches or isbetter than free space. Thus, existing fuel or oil lines of the gasturbine engine 20 of FIG. 1 may be used as waveguides if they haveappropriate dielectric properties.

Further embodiments include allowing transition of EM energy from awaveguide into a free space environment. Some of the SSCs 70A-C, 74 ofFIG. 2 have multiple SCIDs 68A, 68B that reside in a protected Faradaycage (e.g., a shielded volume within shielding 84, 76) filled with airor other fluids. Transitioning energy from a waveguide to and from anopen cavity is required to prevent unwanted signal loss. Embodimentstransition EM energy from TP 78 into a free space environment containingeither air or a fluid within shielding 84 of SSC 70A of FIG. 2 using anexample waveguide 200 of FIG. 4. The waveguide 200 may be an embodimentof the TP 78 or the shielded path 72 of FIG. 2. In some embodiments, EMenergy transitions through multiple interfaces having differentenvironmental characteristics, such as waveguide 250 of FIG. 5 as afurther example of the shielded path 72 of FIG. 2. Waveguides 200, 250can connect multiple SCIDs 68 and may pass through existing components,for instance, in communication path 102 of FIG. 3, to facilitatetransmission of EM power and signaling between devices. The waveguides200, 250 may incorporate “T”s, “Y”s, splitters or other branching typesto facilitate a network topology.

EM energy may be confined to a waveguide, or alternatively can betransmitted through a combination of waveguide and free spacecommunications in a shielded environment, e.g., within shielding 84, 76of FIG. 2, to meet system requirements for signal attenuation anddisturbances. Waveguide 200 of FIG. 4 can include a waveguidetransmitter interface 202 that enables electromagnetic signaltransmission within a waveguide medium or electromagnetic window 204 ina guidance structure 206 to a waveguide transition interface 208. Thewaveguide transmitter interface 202 may be an EM energy emitter, and thewaveguide transition interface 208 may be operable to pass the EM energythrough shaping, an antenna structure, or an active structure to aconfined free space within shielding 84, 76 of FIG. 2. The waveguidemedium 204 can be a gas or liquid, such as air, oil, fuel, soliddielectric, or the like. In some embodiments, the waveguide medium 204is a dielectric. The guidance structure 206 can be a metal tube and maybe integrally formed in/within a component of the gas turbine engine 20of FIG. 1, such as communication path 102 of FIG. 3. In otherembodiments, the guidance structure 206 is an outer edge of a dielectricand need not include a metallic structure. Although depicted as a singlestraight path, it will be understood that the waveguide 200 can bend andbranch to reach multiple SCIDs 68A, 68B of FIG. 2. In other embodiments,the waveguide 200 may take the form of a planer stripline, or trace on aprinted circuit board.

Transitioning EM energy from a waveguide to and from cavities using TP78 and/or shielded paths 72 can present a challenge when SCIDs 68A, 68Bof FIG. 2 are located in higher temperature or pressure environments,especially in environments containing fuel, oil, flammable liquids, orassociated vapors. With further reference to FIG. 5, the waveguide 250enables transitioning of EM energy from a first environment 251 into asecond environment 253 with a higher temperature and/or higher pressurecapable barrier against fluids or gasses. Waveguide 250 of FIG. 5 caninclude a waveguide transmitter interface 252 that enableselectromagnetic signal transmission within a guidance structure 256 to awaveguide transition interface 258. The waveguide transmitter interface252 may be an EM energy emitter in the first environment 251. Thewaveguide transition interface 258 may be operable to pass the EM energythrough shaping, an antenna structure, or an active structure from afirst portion 260 of the waveguide 250 to a second portion 262 of thewaveguide 250. The first portion 260 of the waveguide 250 may have afirst waveguide medium 254 that is different from a second waveguidemedium 264 of the second portion 262. A transition window 266 can beincorporated in the waveguide transition interface 258 as a dielectricor thin metal EM window operable to pass a frequency range of interestbetween the first portion 260 and the second portion 262 of thewaveguide 250. The second portion 262 of the waveguide 250 can alsoinclude a secondary waveguide transition interface 268 in the secondenvironment 253. The secondary waveguide transition interface 268 canact as a seal to prevent different temperatures and/or pressures of thesecond environment 253 from directly contacting the first portion 260 ofthe waveguide 250. The first waveguide medium 254 and the secondwaveguide medium 264 can be different gasses or liquids, such as air,oil, fuel, or the like and may have different nominal pressures and/ortemperatures. In some embodiments, the first waveguide medium 254 and/orthe second waveguide medium 264 is a dielectric. The guidance structure256 can be a metal tube and may be integrally formed on/within acomponent of the gas turbine engine 20 of FIG. 1, such as communicationpath 102 of FIG. 3. The guidance structure may also contain more thanone waveguide transition interface(s) 258 with a correspondingtransition window 266 for redundancy purposes. Although depicted as asingle straight path, it will be understood that the waveguide 250 canbend, “T,” “Y,” and/or branch to reach multiple SCIDs 68A, 68B of FIG.2.

Turning now to FIG. 6, a schematic illustration in accordance with anembodiment of the present disclosure is shown. FIG. 6 provides anexample illustration for employing EM energy to power and read devicessuch as sensors or other control devices, e.g., SCIDs 68A, 68B describedabove. As will be appreciated by those of skill in the art, whether asensor or control device is wired or wireless, some form of power isrequired to obtain a sensor reading. With open air wireless devices,batteries or other energy harvesting methods such as thermo-electric,vibrational, and magnetic coupling configurations have been considered.Utilizing free space, EM energy can be implemented in RFID. Open airtransmission of wireless energy as applicable to energy harvesting insome machine environments is generally not practical because the energyrapidly attenuates over short distances.

In one non-limiting embodiment, use of the transmission path 78, path62, and shielded paths 72 in the form of waveguides (e.g., waveguides200, 250) allows very low transmission losses such that power sources(e.g., RPU 66 of EM devices) can be physically located farther apart ascompared to conventional free space transmitting devices. Further, suchconfigurations of the present disclosure can still deliver enough powerto energize the SCIDs 68A, 68B.

For example, FIG. 6 schematically represents an SCID 300 (i.e., similarto that shown in FIG. 2). The SCID 300 depicted in FIG. 6 receivesenergy from an EM transmitting source 302, such as an RPU describedabove. The SCID 300 includes a rectification and power conditioningmodule 304 configured to rectify and condition power received from theEM transmitting source 302. The rectified and conditioned power is thenprovided to each of the other modules of the SCID 300, as describedherein (e.g., modules 306, 308, 310, etc.). Although shown as separatemodules, the various components and features of the SCID 300 inaccordance with the present disclosure can be configured in more orfewer modules, and in one non-limiting embodiment, a single printedcircuit board component or a more integrated device implemented on asingle package can provide all of the functionality described herein.Thus, FIG. 6 and the nomenclature provided herein is not intended to belimiting or to imply that each module is a separate and distinct unit,but rather is used to convey an operation that can be performed by thesame or different components of the SCID 300.

In addition to power processing, the SCID 300 further includes acommunication interface module 306 that is configured for communicationwith the EM transmitting source 302. That is, the communicationinterface module 306 is configured to receive and process informationreceived in EM transmissions from the EM transmitting source 302. TheSCID 300 includes a control module 308, such as a microcontroller,microprocessor, etc. that can be programmed to control and/orcommunicate with different sensors depending on the application needs.The control module 308 can read and write to a storage module 310, suchas memory (e.g., volatile and/or non-volatile memory). The storagemodule 310 can include identification information associated with SCID300, programs and/or applications to be executed by the control module308, or other data. The control module 308 is further configured toreceive input from an external sensor(s) 312. The external sensor 312can provide a sensor input 314 that is input into the SCID 300 at orthrough a sensor circuit module 316. The sensor circuit module 316 canbe an electrical circuit, module, or component that is selected tointeract with the external sensor 312, and thus may vary depending on aparticular application or sensor configuration. The sensor input 314 isreceived at the sensor circuit module 316 and then converted at an inputconversion module 318 to then be processed at the control module 308. Inone non-limiting embodiment, the control module 308 can be amicrocontroller that is configured to read the sensor input 314 throughthe conversion module 318, which may be an analog-to-digital converter,frequency-to-digital converter, or any other converter that translatesphysical measurements to digital form. Further, in some non-limitingembodiments, the SCID 300 can include an optional control output module320 that can, for example, process and convert instructions or commandsfrom the control module 308 into analog signals and generate an outputsignal 322. The output signal 322 can be a transmission or signal sentfrom the SCID 300 to the external sensor 312 for excitation or to someother external component or device (e.g., a different SCID, an actuator,a sub-system component (SSC) 70, etc.).

The power rectification and conditioning module 304 has the ability toharvest energy from EM signals to power the modules of the SCID 300.Close proximity of the SCID 300 to the EM transmitting source 302 is notrequired due to the power levels of the EM energy delivered by thewaveguides (e.g., waveguides 200, 250). Further, the SCID 300 has theability to perform communications through the communication interfacemodule 306. Moreover, the SCID 300 has the ability to read sensors 312connected to the sensor circuit module 316. Furthermore, the SCID 300has the ability to write information to and read information from thestorage module 310. In some embodiments, the SCID 300 can be configuredto send signals 322 (e.g., analog signals) to an external device.Moreover, the SCID 300 has practical immunity from wireless cybersecurity attacks, EMI, etc. due to Faraday shielding provided about theSCID 300, as described above. Furthermore, in some embodiments, theSCIDs 300 can be multiplexed for communication purposes, as will beappreciated by those of skill in the art.

Turning now to FIG. 7, another schematic illustration of an SCID 400 inaccordance with an embodiment of the present disclosure is shown. TheSCID 400 is a partial schematic, and those of skill in the art willappreciate that features described with respect thereto can beincorporated into any SCID in accordance with the present disclosure, orthe features can be separately provided in a dedicated SCID, dependingon the system requirements and needs. In the embodiments of FIG. 7, theSCID 400 is configured to store identification data, characterizationdata, and/or operational use data for control components. The controlcomponents could be actuators, valves, or sensor systems/sub-systemsthat vary slightly in characteristics between different parts.Accordingly, the SCID 400 can include various features described abovewith respect to FIG. 6, but such features are not shown for simplicity.

As will be appreciated by those of skill in the art, mechanicalcomponents manufactured to the same design specifications do not alwaysperform identically when installed in an operational machine (e.g.,aircraft engines, etc.), both initially and over time. Such variabilitymay be caused by an inability to manufacture parts with no variance ordifferences (e.g., there may always be some amount of variation in anygiven process). Furthermore, in addition to manufacturing variability,over time various components may drift from operational metricsdifferently compared to initial states of the components (e.g., onecomponent may degrade faster or slower than another component). Suchvariation causes loss in precision of machine operation and may causeadditional energy consumption or drift in fault detection indicators dueto off nominal operation scheduled by a control system.

Various component variability (particularly manufacturing variability)can be determined at the time of manufacture. For example, in theaerospace industry, variability in components can be determined andrecorded during acceptance testing before a product or component isshipped or finally installed. Such initial information can be useful incalibration of a final part or machine into which the component isinstalled. For example, such information that is component-specific canbe used to fine-tune the machine, and further can be used toautomatically tune or adjust operational parameters or other control oroperational factors to accommodate component variability.

Furthermore, as noted, component operation can vary significantly overtime, for example due to environmental factors, operator usage profiles,and/or unexpected events that occur during equipment operation.Knowledge of the usage for each component can be useful in knowing whena component is operating off-specification or when maintenance actionmay be required or otherwise recommended. With current state-of-the-artsystems, much of this information can be captured using various sensorsor other equipment, as known in the art. However, such recorded data andinformation is typically stored in other components that are physicallyseparate from the component (e.g., SCID), making life-usage tracking ortroubleshooting at a component supplier very difficult.

In the present disclosure and in particular the embodiment shown in FIG.7, an SCID 400 can communicate with an EM transmitting source 402, suchas an RPU. The RPU can receive information from the SCID 400 to obtaincalibration information and/or other data related to the SCID 400. Suchconfiguration can be used for multiple SCIDs 400 (e.g., each controlcomponent 70A-C, 74 shown in FIG. 2). FIG. 7 illustrates a non-limitingimplementation and configuration of an SCID 400. The SCID 400 in FIG. 7is configured to receive energy from the EM transmitting source 402, andthen can rectify and condition the power using a rectification and powerconditioning module 404. The rectified and conditioned power can then besupplied to each of the other modules within the SCID 400. In theembodiment of FIG. 7, similar to that of FIG. 6, a communicationinterface module 406 is configured to communicate with the EMtransmitting source 402 (e.g., RPU) and also retrieve and storeinformation into a storage module 410 through a control module 408. Thecontrol module 408 can be programmed to characterize different controlcomponents depending on application needs. For example, variouscharacterization curves can be stored in the storage module 410 and caninclude flow rates versus valve position(s) and temperature, flow versuspressure drop and temperature, etc.

During operation of the SCID 400 in this configuration, the storagemodule 410 can also store information about various other information,including, but not limited to, an engine installation, flight profiles,and/or important environmental data from other components that may becommunicated over the EM communication interface (e.g., from the EMtransmitting source 402 or from other sources). Such information can besupplied by a control and health monitoring system and/or other controlsystems or component and written to the storage module 410 in aparticular SCID 400 of a control component.

Such configuration can enable the ability to communicate with EMtransmitting sources (e.g., RPUs) for sending and receiving calibrationdata, life usage data, environmental data, etc. Furthermore, embodimentsof such configuration can enable the ability to utilize calibration datato fine tune control and diagnostic algorithms that utilize the controlcomponent. Moreover, various embodiments can store fault informationdata for components and thus enable monitoring for maintenance (e.g.,removal, repair, replacement, etc.). Additionally, embodiments providedherein can provide an ability to associate the stored data in thecontrol component (e.g., within the storage module 410) with the propercontrol component and thus a technician can obtain historicalinformation or data related to the control component. Furthermore,advantageously, embodiments provided herein can provide an ability tocharacterize and/or track a single device or multiple devices that aregrouped together in the same hardware component that may be physicallycombined with the EM device and thus provide, for example, detailed dataand/or maintenance information. Moreover, in some embodiments, each SCID400 can be configured to supply or otherwise announce identificationinformation to a separate controller or other EM transmitted device whenthe SCID 400 is connected to an EM network (e.g., self-identifying andreporting of the SCID).

Turning now to FIG. 8, another configuration of an SCID 500 inaccordance with an embodiment of the present disclosure is shown. Theembodiment shown in FIG. 8 can be combined with one or more of the abovedescribed features and/or can form a distinct SCID 500. The SCID 500 isconfigured to use EM energy to power and read devices that controleffectors using an externally provided power bus.

As noted above, whether sensors or control devices are wired orwireless, some form of power is required to obtain sensor readings andpower effectors such as electro-hydraulic servo valves (EHSV), directdrive valves (DDV), solenoids, etc. Such effectors may requirerelatively high power levels to control, e.g., compared to the morepassive features described above, or as compared to other priorconfigurations as known in the art. Accordingly, power for effectorssuch as EHSVs, DDVs, solenoids, etc. must come from other sources thanan SCID.

However, in accordance with embodiments provided herein, power foreffectors can be provided from and/or switched from the SCID 500. TheSCID 500 can be similar to that described above, including an EMtransmitting source 502, a rectification and power conditioning module504, a communication interface module 506, a control module 508, astorage module 510, a sensor circuit module 516, an input conversionmodule 518, and can be in communication with an external sensor 512. Incontrast to the above described embodiments, the SCID 500 includes apower output module 524. Those of skill in the art will appreciate thatthe various features of the SCID 500 can be mixed and matched with theother embodiments of the present disclosure, and FIG. 8 is not intendedto be limiting.

Use of waveguides in accordance with the present disclosure, anddescribed above, allows very low transmission losses such that powersources, such as EM transmitting sources, can be physically located muchfurther than conventional free space transmitting devices and stilldeliver enough power to energize the SCID 500. The SCID 500 depicted inFIG. 8 receives energy from an EM transmitting source 502, rectifies andconditions the power in the rectification and power conditioning module504 and provides the conditioned power to each of the other sections(e.g., modules 508, 510, 518, 516, etc.). The control module 508 isresponsible for communicating with the EM transmitting source 502,retrieving and storing information in the storage module 510, readingthe sensor inputs from the external sensor(s), if employed, through thesensor circuit module 516 and the input conversion module 518. Further,the SCID 500 is configured to supply output signals 526 through thepower output module 524, which can provide analog signals (e.g., D/Aconverted signals), pulse width modulations (e.g., through a pulse-widthmodulation converter), etc.

The output signals 526 can be provided to one or more power switchingdevices 528 that are external from the SCID 500. The power switchingdevices 528 can be configured to deliver a power switching controlsignal to an electromechanical device 530 (e.g., EHSV, DDV, solenoid,etc.). The power switching devices 528 can receive higher required powerlevels from an optic or electric power bus 532 after passing through apower conditioning circuit 534. As noted above, the control module canbe programmed to handle different sensors depending on the applicationneeds and further can be programmed to handle and/or control differentelectromechanical devices.

The non-limiting embodiment and features shown and described in FIG. 8enable configurations where close proximity of the SCID 500 with powersources is not required due to the power levels of the EM energydelivered by the waveguides. Further, the control module 508 of the SCID500 can provide the ability to receive electrical or optic power from apower bus 532 and convert it to a suitable power source for an EHSV,DDV, solenoid, or other electromechanical device 530. Further, the SCID500 can provide an ability to control power output to theelectromechanical devices 530 by sending low level D/A, Pulse WidthModulation (PWM) signals, or any other suitable form of signal to thepower switching devices for a switching operation.

Turning now to FIG. 9, an example of an on-chip antenna 600 for use withembodiments of the present disclosure is schematically shown. Theon-chip antenna 600 enables EM devices for power transfer andcommunication with a host or peer devices, as described above.

The free space wavelength of EM radiation is given as λ=c/v; where c isthe speed of light in air (3×10⁸ m/s) and v is the frequency in Hz.Hence at 10 GHz, the wavelength is 3 cm, and at 24 GHz the wavelength isapproximately 1 cm. This is without the presence of a dielectric, whichcould diminish the size wavelength inversely proportional to the squareroot of the dielectric constant, i.e.,λ_(dielectric)=λ_(free space)/(∈)^(1/2). For materials with a dielectricof ˜10, this diminishes the wavelength and hence size of the antennawhich is on the order of the size of the wavelength.

FIG. 9 is an example of an on-chip antenna 600, whose functionality isto absorb EM radiation and can be employed with SCIDs shown anddescribed herein. In some non-limiting embodiments, the on-chip antenna600 is designed to be capable of receiving EM radiation, rectifying theEM radiation (e.g., rectifying power), and turning it into a powersource for the device (e.g., operate as a rectification and powerconditioning module of an SCID shown and described above). Concurrently,the on-chip antenna 600 may be configured to efficiently transmit EMradiation back out of the device (e.g., the SCID). Accordingly, in someconfigurations, the on-chip antenna and the chip itself (e.g., thecomplete SCID) can be co-designed to be both an efficient absorber andradiator (e.g., receive and transmit EM radiation).

In one non-limiting example, the on-chip antenna 600 can be designed tooperate at various frequencies. For example, the on-chip antenna 600 canbe configured to operate at various frequencies or ranges offrequencies, including, but not limited to 1-100 GHz, 3-4.5 GHz, 10 GHz,24 GHz, 60 GHz, or 76-77 GHz. In various embodiments, the EM radiationcan be rectified and the EM energy used to power an RFID designed tooperate at such a frequency. Advantageously, embodiments of the presentdisclosure enable an antenna that is integrated onto the surface of adevice (e.g., SCID) that both powers the device and efficiently radiatesback at a power reception frequency. Further, in some embodiments, theon-chip antenna 600 can have an integrated dielectric for smaller size,and thus provide additional benefits.

In some embodiments, the on-chip antenna 600 can have an isolated groundplane for high efficiency. Moreover, in some non-limiting embodiments,the on-chip antenna 600 can be composed of a non-oxidizing metal such asgold, platinum, stainless steel, titanium, etc. Furthermore, adielectric can be used to enable miniaturize the size of the on-chipantenna 600. Due to optimized size and shape, the placement of theon-chip antenna 600 on the device, and subsequently the placement of thedevice itself, can be made so that the orientation of the on-chipantenna 600 maximizes EM absorption and transmission. Furthermore, inaccordance with some embodiments, the on-chip antenna can be designedand/or otherwise configured for selective polarization, or mode, whetherthe mode is primarily magnetic or electric, and further can be designedto operate internal to a waveguide structure.

In the system described, SCIDs 300, 400, 500 include materials suited tothe operation environment. In some embodiments the SCIDs 300, 400, 500include one or more semiconductor devices formed using high temperaturecompatible semiconductor materials. The operation environment for atleast a portion of the SCIDs can be a high temperature environment,operating at temperatures of greater than 200° C. At these temperatures,silicon is not an effective semiconductor. At temperatures greater than200° C. the SCID can include a wide band gap semiconductor, for example,silicon on insulator (SOI), silicon carbide (SiC) or gallium nitride(GaN), boron nitride, aluminum nitride, or combinations comprising atleast one of the foregoing as the semiconductor material. When a deviceutilizes a wide band gap semiconductor as the semiconductor material thedevice is referred to herein as a wide band gap semiconductor device.

In some embodiments the SCID and/or the wide band gap semiconductordevice includes an integrated device having: bipolar junctiontransistors, field effect transistors, or a combination thereof. Thiscombination can be in the form of elements on a printed circuit board orintegrated holistically into a single application specific integratedcircuit; and variations thereof.

Conventional silicon based integrated circuit SCIDs may be used for mostnear room temperature devices; however, for progressively highertemperature applications one must use alternate semiconductor structuresand even alternative materials. Alternative materials include silicon oninsulator (SOI), silicon carbide (SiC), gallium nitride (GaN), diamond,boron nitride, aluminum nitride, or combinations comprising at least oneof the foregoing. The wide band gap semiconductor devices can be simplebipolar structures, MOSFETs, JFETs, light emitting diodes (LEDs),oscillators, diodes, their variants, and combinations comprising atleast one of the foregoing. These devices can be configured together tocreate up-integrated circuits, and then still further integrated tosystems on chip (SIC), system in a package (SIP) and similar descriptorsentailing integration of the like.

At the frequencies and high temperatures of SCIDs 300, 400, 500mentioned previously, silicon semiconductors would be subject changesthat would preclude operation in environments that exceed 100° C. SOIsemiconductors have potential capability to 300° C., but neither aresuitable for machines temperatures that reach 500° C. Error! Referencesource not found. shows the temperature capability of SiC and GaN due tothe low intrinsic carrier concentration at elevated temperatures.Silicon based devices would have high leakage above approximately 150°C. due to excitation of intrinsic carriers thereby significantlyreducing the functionality of these devices. However, gas turbine engineenvironments can range from ambient temperatures to 1000° C. evenwithout total immersion into the combustion process. Consequently, widebandgap based semiconductor devices offer a means to realize the SCIDsarchitecture and components described in 300, 400, 500.

Use of wide band gap materials can also enable the integration ofon-chip antennas 600 to reduce size and increase reliability of SCIDs300, 400, 500.

While the present disclosure has been described in detail in connectionwith only a limited number of embodiments, it should be readilyunderstood that the present disclosure is not limited to such disclosedembodiments. Rather, the present disclosure can be modified toincorporate any number of variations, alterations, substitutions orequivalent arrangements not heretofore described, but which arecommensurate with the spirit and scope of the present disclosure.Additionally, while various embodiments of the present disclosure havebeen described, it is to be understood that aspects of the presentdisclosure may include only some of the described embodiments.Accordingly, the present disclosure is not to be seen as limited by theforegoing description, but is only limited by the scope of the appendedclaims.

1. A system of a machine, the system comprising: a network of aplurality of sensing/control/identification devices distributedthroughout the machine, each of the sensing/control/identificationdevices associated with at least one sub-system component of the machineand operable to communicate through a plurality of electromagneticsignals; shielding surrounding at least one of thesensing/control/identification devices to contain the electromagneticsignals proximate to the at least one sub-system component; acommunication path integrally formed in a component of the machine toroute a portion of the electromagnetic signals through the component;and a remote processing unit operable to communicate with the network ofthe sensing/control/identification devices through the electromagneticsignals, wherein at least a portion of thesensing/control/identification devices comprise a wide band gapsemiconductor device.
 2. The system as recited in claim 1, wherein thewide band gap semiconductor device comprises silicon on insulator (SOI),silicon carbide (SiC), gallium nitride (GaN), boron nitride, aluminumnitride, or a combination comprising at least one of the foregoing. 3.The system as recited in claim 1, wherein the wide band gapsemiconductor device operates at a temperature greater than 200 degreesC.
 4. The system as recited in claim 1, wherein the wide band gapsemiconductor device comprises an integrated device having bipolarjunction transistors, field effect transistors, or a combinationcomprising at least one of the foregoing.
 5. The system as recited inclaim 1, wherein the wide band gap semiconductor device comprises abipolar structure, MOSFET, JFET, light emitting diode, oscillator, diodeor a combination comprising at least one of the foregoing.
 6. The systemas recited in claim 1, wherein the wide band gap semiconductor device ispart of an integrated circuit.
 7. The system as recited in claim 1,wherein the wide band gap semiconductor device comprises SiC, GaN or acombination thereof.
 8. A system for a gas turbine engine, the systemcomprising: a network of a plurality of sensing/control/identificationdevices distributed throughout the gas turbine engine, each of thesensing/control/identification devices associated with at least onesub-system component of the gas turbine engine and operable tocommunicate through a plurality of electromagnetic signals; shieldingsurrounding at least one of the sensing/control/identification devicesto contain the electromagnetic signals proximate to the at least onesub-system component; a communication path integrally formed in acomponent of the gas turbine engine to route a portion of theelectromagnetic signals through the component; and a remote processingunit operable to communicate with the network of thesensing/control/identification devices through the electromagneticsignals, wherein at least a portion of thesensing/control/identification devices comprise a wide band gapsemiconductor device.
 9. The system as recited in claim 8, wherein thewide band gap semiconductor device comprises silicon on insulator (SOI),silicon carbide (SiC) or gallium nitride (GaN), boron nitride, aluminumnitride, or a combination comprising at least one of the foregoing. 10.The system as recited in claim 8, wherein the wide band gapsemiconductor device operates at a temperature greater than 200 degreesC.
 11. The system as recited in claim 8, wherein the wide band gapsemiconductor device comprises an integrated device having bipolarjunction transistors, field effect transistors, or a combinationcomprising at least one of the foregoing.
 12. The system as recited inclaim 8, wherein the wide band gap semiconductor device comprises abipolar structure, MOSFET, JFET, light emitting diode, oscillator, diodeor a combination comprising at least one of the foregoing.
 13. Thesystem as recited in claim 8, wherein the wide band gap semiconductordevice is part of an integrated circuit.
 14. The system as recited inclaim 8, wherein the wide band gap semiconductor device comprises SiC,GaN or a combination thereof.
 15. A method of electromagneticcommunication through a machine, the method comprising: transmittingcommunication signals between a remote processing unit and a network ofa plurality of control/sensing/identification devices in the machineusing a plurality of electromagnetic signals wherein the plurality ofelectromagnetic signals provide power to the control/sensing devices andfurther wherein the at least a portion of thecontrol/sensing/identification devices comprise a wide band gapsemiconductor device.
 16. The method as recited in claim 15, wherein thewide band gap semiconductor device comprises silicon on insulator (SOI),silicon carbide (SiC), gallium nitride (GaN), boron nitride, aluminumnitride, or a combination comprising at least one of the foregoing. 17.The method as recited in claim 15, wherein the wide band gapsemiconductor device operates at a temperature greater than 200 degreesC.
 18. The method as recited in claim 15, wherein the wide band gapsemiconductor device comprises an integrated device having bipolarjunction transistors, field effect transistors, or a combinationcomprising at least one of the foregoing.
 19. The method as recited inclaim 15, wherein the wide band gap semiconductor device is part of anintegrated circuit.
 20. The method as recited in claim
 19. wherein thewide band gap semiconductor device comprises SiC, GaN or a combinationthereof.